mGP
Mutlilevel Global Placement
VLSI CAD
LAB
Department
of Computer Science
University of
California, Los Angeles
Recent studies suggest that synthesis and optimization under
the physical hierarchy is a promising way to achieve timing closure between
synthesis and layout for deep submicron designs. In UCLA VLSI CAD LAB,
we focus on how to build a good physical hierarchy for performance optimization.
The logical hierarchy is first flattened to the extent that we are certain
circuit elements in each module have ``physical locality'' i.e., the circuits
in a module should physically stay together, and then coarse/global placement
is performed on this flattened design to place the placeable objects and
generate a physical hierarchy.
Overview
mGP (formly called mPG), a multilevel global/coarse placement framework
which is based on the multilevel optimization paradigm, is developed for
physical hierarchy generation. The placement engine is based on the simulated-annealing
technique because of its flexibility of integrating various design objectives
and handling constraints. It can suport large-scale standard-cell placement,
mixed-sized (standard-cells mixed with macros) placement for wirelength
minimization and routability optimization.
Reference
-
C.-C. Chang, J. Cong, D. Pan, and X. Yuan, "Multilevel
Global Placement with Congestion Control," IEEE Transactions on
Computer-Aided Design of Integrated Circuits and Systems, vol. 22,
no. 4, pp. 395-409, April 2003.
-
C.-C. Chang, J. Cong, and X. Yuan, "Multi-level
Placement for Large-Scale Mixed-Size IC Designs,", Proc. Asia South
Pacific Design Automation Conference, pp 325-330, January 2003.
-
C-C. Chang, J. Cong, Z. Pan and X. Yuan, "Physical
Hierarchy Generation with Routing Congestion Control," Proc. International
Symposium on Physical Design, pp36-41, San Diego, California, April
2002.
Download
Binary code of mGP under Solaris
Benchmarks used for testing
Related
Links
GSRC
bookshelf placement slot
VLSI CAD LAB in
UCLA
Optimality
Study of VLSI CAD Algorithms
Acknowledgment
This project is supported in part by Semiconductor
Research Corporation under contracts 98-DJ-605 and 2001-TJ-910, National
Science Foundation under the grant CCR-0096383,
a Faculty Partnership Award from IBM Corporation, and grants from Intel
Corporation and Fujitsu Laboratories of America under the California
MICRO program.
Please direct your questions, comments and bug reports to mgp@cadlab.cs.ucla.edu.
Copyright 2001-2003. The Regents of the
University of California.
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