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Research Interests:

• Physical Design Automation
• 3-D IC technology
• Linear & Nonlinear Optimizations

Education

• Ph.D. student, Computer Science Department, UCLA, since Fall 2005.
• B.Sc. in Computer Science, Peking University, Beijing, China, 2005.

Projects

• Constrained Placement by Multilevel Optimization

• 3-D Thermal-Aware Physical Design

Publication

• Jason Cong, Guojie Luo, Jie Wei, and Yan Zhang, "Thermal-Aware 3D IC Placement via Transformation", Proceedings of the 12th Asia and South Pacific Design Automation Conference (ASP-DAC 2007), Yokohama, Japan, pp. 780-785, January 2007.


• Jason Cong, and Guojie Luo, "Highly Efficient Gradient Computation for Density Constrained Analytical Placement Problems," Proceedings of the International Symposium on Physical Design, Portland, OR, April 2008.


• Jason Cong, Chunyue Liu, and Guojie Luo, "Quantitative Studies of Impact of 3D IC Design on Repeater Usage", Proceedings of 25th International VLSI/ULSI Multilevel Interconnection Conference (VMIC), Fremont, CA, pp. 344-348, October 2008. (Invited Paper)


• Jason Cong and Guojie Luo, "A Multilevel Analytical Placement for 3D ICs", Proceedings of the 14th Asia and South Pacific Design Automation Conference (ASP-DAC 2009), Yokohama, Japan, pp. 361-366, January 2009.

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